English: Demonstration of ultrasonic wedge bonding of an aluminium wire between gold electrodes on a PCB board and gold electrodes on a sapphire substrate, reverse bonding order, at the NanoFabLab at AlbaNova University Center/Stockholm University.
Deitsch: Ultraschall-Wedge-Wedge-Bonden eines Aluminium-Drahts zwischen Gold-Kontakten einer Leiterplatte und auf einem Saphir-Substrat. NanoFabLab am AlbaNova Universitätszentrum/Stockholms Universität.
This file was selected as the media of the day for 04 July 2013. It was captioned as follows:
English: Demonstration of ultrasonic wedge bonding of an aluminium wire between gold electrodes on a PCB board and gold electrodes on a sapphire substrate, reverse bonding order, at the NanoFabLab at AlbaNova University Center/Stockholm University.
Other languages
English: Demonstration of ultrasonic wedge bonding of an aluminium wire between gold electrodes on a PCB board and gold electrodes on a sapphire substrate, reverse bonding order, at the NanoFabLab at AlbaNova University Center/Stockholm University.
中文(简体):引线接合
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